{"id":68,"date":"2023-07-13T15:24:29","date_gmt":"2023-07-13T15:24:29","guid":{"rendered":"https:\/\/www.leis.um.si\/?page_id=68"},"modified":"2023-09-04T07:10:32","modified_gmt":"2023-09-04T07:10:32","slug":"microelectronics","status":"publish","type":"page","link":"https:\/\/leis.um.si\/?page_id=68","title":{"rendered":"Microelectronics"},"content":{"rendered":"\n<h1 class=\"wp-block-heading\">Microelectronics<\/h1>\n\n\n\n<p><strong>LEIS provides research and development activities towards hybrid mixed signal integrated systems providing quantum level sensing capabilities while increasing the embedded intelligence.<\/strong><\/p>\n\n\n\n<p>To ensure a high degree of miniaturization with a competitive advantage to preserve intellectual rights over the primary technologies LIES is covering a full integrated circuit development life cycle from the design, characterisation, modelling, reliability, and qualification. LEIS provides a faster path and the equipment to collect high-quality on-wafer measurement data to tackle the challenging test applications and to deliver critical data for devices and integrated circuits.<\/p>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg\" alt=\"\" class=\"wp-image-236\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-7.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-768x1024.jpg\" alt=\"\" class=\"wp-image-237\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-6.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-768x1024.jpg\" alt=\"\" class=\"wp-image-238\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-8.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-768x1024.jpg\" alt=\"\" class=\"wp-image-239\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"900\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg\" alt=\"\" class=\"wp-image-226\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg 1200w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-300x225.jpg 300w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-1024x768.jpg 1024w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-768x576.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"900\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg\" alt=\"\" class=\"wp-image-230\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg 1200w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-300x225.jpg 300w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-1024x768.jpg 1024w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-768x576.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg\" alt=\"\" class=\"wp-image-228\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg\" alt=\"\" class=\"wp-image-229\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Microelectronics LEIS provides research and development activities towards hybrid mixed signal integrated systems providing quantum level sensing capabilities while increasing the embedded intelligence. To ensure a high degree of miniaturization with a competitive advantage to preserve intellectual rights over the primary technologies LIES is covering a full integrated circuit development life cycle from the design, [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"no-sidebar","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-68","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/68","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/leis.um.si\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=68"}],"version-history":[{"count":6,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/68\/revisions"}],"predecessor-version":[{"id":240,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/68\/revisions\/240"}],"wp:attachment":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=68"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}