{"id":70,"date":"2023-07-13T15:24:46","date_gmt":"2023-07-13T15:24:46","guid":{"rendered":"https:\/\/www.leis.um.si\/?page_id=70"},"modified":"2023-09-04T07:11:27","modified_gmt":"2023-09-04T07:11:27","slug":"mikroelektronika","status":"publish","type":"page","link":"https:\/\/leis.um.si\/?page_id=70&lang=sl","title":{"rendered":"Mikroelektronika"},"content":{"rendered":"\n<h1 class=\"wp-block-heading\">Mikroelektronika<\/h1>\n\n\n\n<p><strong>LEIS zagotavlja raziskovalne in razvojne aktivnosti v smeri hibridnih analognih in digitalnih integriranih sistemov, ki zagotavljajo zmo\u017enosti zaznavanja na kvantnem nivoju, hkrati pa pove\u010dujejo vgrajeno inteligenco<\/strong>.<\/p>\n\n\n\n<p>Z namenom zagotavljanja visoke stopnje miniaturizacije s konkuren\u010dno prednostjo ohranjanja intelektualnih pravic nad primarnimi tehnologijami, LEIS pokriva celoten \u017eivljenjski cikel razvoja integriranega vezja od zasnove, karakterizacije, modeliranja, zanesljivosti in kvalifikacije. LEIS zagotavlja hitrej\u0161o pot in opremo za zbiranje visokokakovostnih merilnih podatkov na polprevodni\u0161ki rezini z namenom re\u0161evanja zahtevnih testnih aplikacij in zagotavljanja kriti\u010dnih podatkov za naprave in integrirana vezja.<\/p>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg\" alt=\"\" class=\"wp-image-236\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-5-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-7.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-768x1024.jpg\" alt=\"\" class=\"wp-image-237\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-7.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-6.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-768x1024.jpg\" alt=\"\" class=\"wp-image-238\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-6.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-8.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"1024\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-768x1024.jpg\" alt=\"\" class=\"wp-image-239\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-768x1024.jpg 768w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-8.jpg 900w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"900\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg\" alt=\"\" class=\"wp-image-226\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0.jpg 1200w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-300x225.jpg 300w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-1024x768.jpg 1024w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-0-768x576.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"900\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg\" alt=\"\" class=\"wp-image-230\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3.jpg 1200w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-300x225.jpg 300w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-1024x768.jpg 1024w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-3-768x576.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/a><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-b5ae2e45 wp-block-group-is-layout-flex\" style=\"margin-top:var(--wp--preset--spacing--30);margin-bottom:var(--wp--preset--spacing--30);padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\">\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg\" alt=\"\" class=\"wp-image-228\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-1-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full has-custom-border\"><a href=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"1200\" src=\"https:\/\/www.leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg\" alt=\"\" class=\"wp-image-229\" style=\"border-top-left-radius:8px;border-top-right-radius:8px;border-bottom-left-radius:8px;border-bottom-right-radius:32px;aspect-ratio:1;object-fit:cover\" srcset=\"https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2.jpg 900w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2-225x300.jpg 225w, https:\/\/leis.um.si\/wp-content\/uploads\/leis-microelectronics-2-768x1024.jpg 768w\" sizes=\"auto, (max-width: 900px) 100vw, 900px\" \/><\/a><\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Mikroelektronika LEIS zagotavlja raziskovalne in razvojne aktivnosti v smeri hibridnih analognih in digitalnih integriranih sistemov, ki zagotavljajo zmo\u017enosti zaznavanja na kvantnem nivoju, hkrati pa pove\u010dujejo vgrajeno inteligenco. Z namenom zagotavljanja visoke stopnje miniaturizacije s konkuren\u010dno prednostjo ohranjanja intelektualnih pravic nad primarnimi tehnologijami, LEIS pokriva celoten \u017eivljenjski cikel razvoja integriranega vezja od zasnove, karakterizacije, modeliranja, zanesljivosti [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"no-sidebar","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-70","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/70","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/leis.um.si\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=70"}],"version-history":[{"count":12,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/70\/revisions"}],"predecessor-version":[{"id":241,"href":"https:\/\/leis.um.si\/index.php?rest_route=\/wp\/v2\/pages\/70\/revisions\/241"}],"wp:attachment":[{"href":"https:\/\/leis.um.si\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=70"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}